Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6784002 | Method to make wafer laser marks visable after bumping process | Hui Wang, Hwei-Mei Yu, Ta-Yang Lin, Charles Tseng | 2004-08-31 |
| 6756184 | Method of making tall flip chip bumps | Chiou-Shian Peng, Euegene Chu, Alex Fahn, Kenneth Chenghao Lin, Gilbert Fane +1 more | 2004-06-29 |