Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6836018 | Wafer level package and method for manufacturing the same | Gu-Sung Kim, Dong-Hyeon Jang, Min Young Son | 2004-12-28 |
| 6818998 | Stacked chip package having upper chip provided with trenches and method of manufacturing the same | Yong-Hwan Kwon, Se-Yong Oh | 2004-11-16 |
| 6791196 | Semiconductor devices with bonding pads having intermetal dielectric layer of hybrid configuration and methods of fabricating the same | Dong-Whee Kwon, Jin Hyuk Lee, Yun Heub Song | 2004-09-14 |
| 6717272 | Reinforced bond-pad substructure and method for fabricating the same | Jin Hyuk Lee, Dong-Whee Kwon, Ji-Yong You, Hye-Soo Shin | 2004-04-06 |