Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6791196 | Semiconductor devices with bonding pads having intermetal dielectric layer of hybrid configuration and methods of fabricating the same | Jin Hyuk Lee, Yun Heub Song, Sa-Yoon Kang | 2004-09-14 |
| 6717272 | Reinforced bond-pad substructure and method for fabricating the same | Jin Hyuk Lee, Sa-Yoon Kang, Ji-Yong You, Hye-Soo Shin | 2004-04-06 |