Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6717272 | Reinforced bond-pad substructure and method for fabricating the same | Jin Hyuk Lee, Sa-Yoon Kang, Dong-Whee Kwon, Ji-Yong You | 2004-04-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6717272 | Reinforced bond-pad substructure and method for fabricating the same | Jin Hyuk Lee, Sa-Yoon Kang, Dong-Whee Kwon, Ji-Yong You | 2004-04-06 |