Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6812578 | Semiconductor device bonding pad resistant to stress and method of fabricating the same | Shin-Hye Kim, Tae-Gyeong Chung, Nam-Seog Kim, Woo-Dong Lee | 2004-11-02 |
| 6791196 | Semiconductor devices with bonding pads having intermetal dielectric layer of hybrid configuration and methods of fabricating the same | Dong-Whee Kwon, Yun Heub Song, Sa-Yoon Kang | 2004-09-14 |
| 6721831 | Method for controlling bus in digital interface | — | 2004-04-13 |
| 6717272 | Reinforced bond-pad substructure and method for fabricating the same | Sa-Yoon Kang, Dong-Whee Kwon, Ji-Yong You, Hye-Soo Shin | 2004-04-06 |
| 6709964 | Semiconductor device and manufacturing method using a stress-relieving film attached to solder joints | — | 2004-03-23 |