Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6791196 | Semiconductor devices with bonding pads having intermetal dielectric layer of hybrid configuration and methods of fabricating the same | Dong-Whee Kwon, Jin Hyuk Lee, Sa-Yoon Kang | 2004-09-14 |