YK

Yong-Hwan Kwon

Samsung: 1 patents #906 of 2,858Top 35%
📍 Daejeon, CA: #25 of 55 inventorsTop 50%
Overall (2004): #82,500 of 270,089Top 35%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6818998 Stacked chip package having upper chip provided with trenches and method of manufacturing the same Se-Yong Oh, Sa-Yoon Kang 2004-11-16