Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6818998 | Stacked chip package having upper chip provided with trenches and method of manufacturing the same | Yong-Hwan Kwon, Sa-Yoon Kang | 2004-11-16 |
| 6812567 | Semiconductor package and package stack made thereof | Jin Ho Kim | 2004-11-02 |