Issued Patents 2004
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6821407 | Anode and anode chamber for copper electroplating | Jonathan D. Reid, Timothy M. Archer, Thomas Tan Vu, Seshasayee Varadarajan, Jon Henri +3 more | 2004-11-23 |
| 6800187 | Clamshell apparatus for electrochemically treating wafers | Jonathan D. Reid, R. Marshall Stowell, Evan E. Patton, Jeff Hawkins | 2004-10-05 |
| 6793796 | Electroplating process for avoiding defects in metal features of integrated circuit devices | Jonathan D. Reid, David Craig Smith, Jon Henri, Sesha Varadarajan | 2004-09-21 |
| 6773571 | Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources | Evan E. Patton, Brian Paul Blackman, Jonathan D. Reid, Thomas A. Ponnuswamy, Harold D. Perry | 2004-08-10 |
| 6755954 | Electrochemical treatment of integrated circuit substrates using concentric anodes and variable field shaping elements | Timothy Cleary, Michael J. Janicki, Edmund Minshall, Thomas A. Ponnuswamy | 2004-06-29 |
| 6755946 | Clamshell apparatus with dynamic uniformity control | Evan E. Patton, Jonathan D. Reid, Jeffrey A. Hawkins, Dinesh S. Kalakkad | 2004-06-29 |
| 6713122 | Methods and apparatus for airflow and heat management in electroless plating | John B. Alexy, Jingbin Feng | 2004-03-30 |
| 6709565 | Method and apparatus for uniform electropolishing of damascene ic structures by selective agitation | Robert J. Contolini, Eliot K. Broadbent, John Drewery | 2004-03-23 |