Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6773571 | Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources | Steven T. Mayer, Evan E. Patton, Brian Paul Blackman, Jonathan D. Reid, Harold D. Perry | 2004-08-10 |
| 6755954 | Electrochemical treatment of integrated circuit substrates using concentric anodes and variable field shaping elements | Steven T. Mayer, Timothy Cleary, Michael J. Janicki, Edmund Minshall | 2004-06-29 |