Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6800187 | Clamshell apparatus for electrochemically treating wafers | Jonathan D. Reid, Steven T. Mayer, R. Marshall Stowell, Jeff Hawkins | 2004-10-05 |
| 6773571 | Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources | Steven T. Mayer, Brian Paul Blackman, Jonathan D. Reid, Thomas A. Ponnuswamy, Harold D. Perry | 2004-08-10 |
| 6755946 | Clamshell apparatus with dynamic uniformity control | Jonathan D. Reid, Jeffrey A. Hawkins, Dinesh S. Kalakkad, Steven T. Mayer | 2004-06-29 |
| 6716334 | Electroplating process chamber and method with pre-wetting and rinsing capability | Jonathan D. Reid, Steven W. Taatjes, Robert J. Contolini | 2004-04-06 |