Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6773571 | Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources | Steven T. Mayer, Evan E. Patton, Jonathan D. Reid, Thomas A. Ponnuswamy, Harold D. Perry | 2004-08-10 |