Issued Patents 2004
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6821407 | Anode and anode chamber for copper electroplating | Timothy M. Archer, Thomas Tan Vu, Seshasayee Varadarajan, Jon Henri, Steven T. Mayer +3 more | 2004-11-23 |
| 6800187 | Clamshell apparatus for electrochemically treating wafers | Steven T. Mayer, R. Marshall Stowell, Evan E. Patton, Jeff Hawkins | 2004-10-05 |
| 6793796 | Electroplating process for avoiding defects in metal features of integrated circuit devices | David Craig Smith, Steven T. Mayer, Jon Henri, Sesha Varadarajan | 2004-09-21 |
| 6773571 | Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources | Steven T. Mayer, Evan E. Patton, Brian Paul Blackman, Thomas A. Ponnuswamy, Harold D. Perry | 2004-08-10 |
| 6755946 | Clamshell apparatus with dynamic uniformity control | Evan E. Patton, Jeffrey A. Hawkins, Dinesh S. Kalakkad, Steven T. Mayer | 2004-06-29 |
| 6716334 | Electroplating process chamber and method with pre-wetting and rinsing capability | Steven W. Taatjes, Robert J. Contolini, Evan E. Patton | 2004-04-06 |