Issued Patents 2004
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6790773 | Process for forming barrier/seed structures for integrated circuits | Ronald A. Powell | 2004-09-14 |
| 6774039 | Process scheme for improving electroplating performance in integrated circuit manufacture | — | 2004-08-10 |
| 6764168 | Sensor for detecting droplet characteristics | Henner Meinhold, Mark L. Rea, Sachin M. Chinchwadkar, Fred J. Chetcuti | 2004-07-20 |
| 6756307 | Apparatus for electrically planarizing semiconductor wafers | John C. Kelly, Wilbert van den Hoek | 2004-06-29 |
| 6743661 | Method of fabricating an integrated circuit package utilizing an interposer surrounded by a flexible dielectric material with conductive posts | — | 2004-06-01 |
| 6719886 | Method and apparatus for ionized physical vapor deposition | Glyn Reynolds, Derrek Andrew Russell, Jozef Brcka, Mirko Vukovic, Michael Grapperhaus +2 more | 2004-04-13 |
| 6709565 | Method and apparatus for uniform electropolishing of damascene ic structures by selective agitation | Steven T. Mayer, Robert J. Contolini, Eliot K. Broadbent | 2004-03-23 |
| 6699396 | Methods for electroplating large copper interconnects | — | 2004-03-02 |