Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6815228 | Film thickness measuring method of member to be processed using emission spectroscopy and processing method of the member using the measuring method | Tatehito Usui, Takashi Fujii, Motohiko Yoshigai | 2004-11-09 |
| 6815365 | Plasma etching apparatus and plasma etching method | Toshio Masuda, Kazue Takahashi, Mitsuru Suehiro, Saburo Kanai | 2004-11-09 |
| 6758647 | System for producing wafers | Yoichi Uchimaki, Yuko Egawa | 2004-07-06 |
| 6716300 | Emission spectroscopic processing apparatus | Shizuaki Kimura, Tatehito Usui, Takashi Fujii | 2004-04-06 |