Issued Patents 2004
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6821888 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding | Simon Chooi, Meisheng Zhou, John Sudijono, Subhash Gupta, Sudipto Ranendra Roy | 2004-11-23 |
| 6813796 | Apparatus and methods to clean copper contamination on wafer edge | Sudipto Ranendra Roy, Subhash Gupta, Simon Chooi, Xu Yi, Mei Sheng Zhou +2 more | 2004-11-09 |
| 6803305 | Method for forming a via in a damascene process | Daniel Yen, Wei Cheng, Ding Yi | 2004-10-12 |
| 6720204 | Method of using hydrogen plasma to pre-clean copper surfaces during Cu/Cu or Cu/metal bonding | John Sudijono, Mei Sheng Zhou, Simon Chooi, Subhash Gupta, Sudipto Ranendra Roy +2 more | 2004-04-13 |
| 6705512 | Method of application of conductive cap-layer in flip-chip, cob, and micro metal bonding | Kwok Keung Paul Ho, Simon Chooi, Yi Xu, Mei Sheng Zhou, John Sudijono +2 more | 2004-03-16 |
| 6692579 | Method for cleaning semiconductor structures using hydrocarbon and solvents in a repetitive vapor phase/liquid phase sequence | Sudipto Ranendra Roy, Yi Xu, Simon Chooi, Mei Sheng Zhou, John Sudijono +2 more | 2004-02-17 |
| 6686279 | Method for reducing gouging during via formation | Daniel Yen, Wei Cheng, Lee Yuan Ping | 2004-02-03 |
| 6683002 | Method to create a copper diffusion deterrent interface | Simon Chooi, Mei Sheng Zhou, John Sudijono, Subhash Gupta, Sudipto Ranendra Roy +2 more | 2004-01-27 |