Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6720204 | Method of using hydrogen plasma to pre-clean copper surfaces during Cu/Cu or Cu/metal bonding | John Sudijono, Yakub Aliyu, Mei Sheng Zhou, Simon Chooi, Subhash Gupta +2 more | 2004-04-13 |
| 6705512 | Method of application of conductive cap-layer in flip-chip, cob, and micro metal bonding | Kwok Keung Paul Ho, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono +2 more | 2004-03-16 |
| 6692579 | Method for cleaning semiconductor structures using hydrocarbon and solvents in a repetitive vapor phase/liquid phase sequence | Sudipto Ranendra Roy, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono +2 more | 2004-02-17 |
| 6690091 | Damascene structure with reduced capacitance using a boron carbon nitride passivation layer, etch stop layer, and/or cap layer | Simon Chooi, Mei Sheng Zhou | 2004-02-10 |
| 6683002 | Method to create a copper diffusion deterrent interface | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Subhash Gupta +2 more | 2004-01-27 |