Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6790374 | Plasma etch method for forming plasma etched silicon layer | Xuechun Dai | 2004-09-14 |
| 6705512 | Method of application of conductive cap-layer in flip-chip, cob, and micro metal bonding | Simon Chooi, Yi Xu, Yakub Aliyu, Mei Sheng Zhou, John Sudijono +2 more | 2004-03-16 |