Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6821888 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding | Yakub Aliyu, Simon Chooi, John Sudijono, Subhash Gupta, Sudipto Ranendra Roy | 2004-11-23 |