Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6667230 | Passivation and planarization process for flip chip packages | Dian-Hau Chen, Lin-June Wu | 2003-12-23 |
| 6664177 | Dielectric ARC scheme to improve photo window in dual damascene process | Chung-Hung Lu, Szu-An Wu, Ya-Li Tai, Kun Liu | 2003-12-16 |
| 6635576 | Method of fabricating borderless contact using graded-stair etch stop layers | Meng-Chang Liu, Lin-June Wu | 2003-10-21 |
| 6551927 | CoSix process to improve junction leakage | Dian-Hau Chen, Yu-Ku Lin, Tong-Hua Kuan, Jin-Kuen Lan | 2003-04-22 |