Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6667230 | Passivation and planarization process for flip chip packages | Dian-Hau Chen, Kwang-Ming Lin | 2003-12-23 |
| 6635576 | Method of fabricating borderless contact using graded-stair etch stop layers | Meng-Chang Liu, Kwang-Ming Lin | 2003-10-21 |
| 6611028 | Dynamic substrate-coupled electrostatic discharging protection circuit | Tao Cheng, Jian-Hsing Lee | 2003-08-26 |
| 6582981 | Method of using a tunneling diode in optical sensing devices | Ho-Yin Yiu, Chein-Ling Jan, Jen-Pan Wang | 2003-06-24 |
| 6531382 | Use of a capping layer to reduce particle evolution during sputter pre-clean procedures | Tao Cheng, Wen-Hsin Huang, Jiun-Pyng You, Shih-Tzung Chang, Ming-jei LEE +4 more | 2003-03-11 |