Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6626741 | Method for improving thickness uniformity on a semiconductor wafer during chemical mechanical polishing | Ting-Chun Wang, Kei-Wei Chen, Yu-Ku Lin, Ying-Lang Wang | 2003-09-30 |
| 6531382 | Use of a capping layer to reduce particle evolution during sputter pre-clean procedures | Tao Cheng, Wen-Hsin Huang, Jiun-Pyng You, Lin-June Wu, Ming-jei LEE +4 more | 2003-03-11 |