Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6626741 | Method for improving thickness uniformity on a semiconductor wafer during chemical mechanical polishing | Ting-Chun Wang, Kei-Wei Chen, Shih-Tzung Chang, Ying-Lang Wang | 2003-09-30 |
| 6551927 | CoSix process to improve junction leakage | Dian-Hau Chen, Kwang-Ming Lin, Tong-Hua Kuan, Jin-Kuen Lan | 2003-04-22 |
| 6531382 | Use of a capping layer to reduce particle evolution during sputter pre-clean procedures | Tao Cheng, Wen-Hsin Huang, Jiun-Pyng You, Lin-June Wu, Shih-Tzung Chang +4 more | 2003-03-11 |
| 6514673 | Rule to determine CMP polish time | Hway-Chi Lin, Wen-Pin Chang, Ying-Lang Wang | 2003-02-04 |