Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6667230 | Passivation and planarization process for flip chip packages | Lin-June Wu, Kwang-Ming Lin | 2003-12-23 |
| 6664194 | Photoexposure method for facilitating photoresist stripping | Chiang-Jen Peng, Wei-Kay Chiu | 2003-12-16 |
| 6652666 | Wet dip method for photoresist and polymer stripping without buffer treatment step | Ching-Tien Ma, Chen-Hsi Shih, Gau-Ming Lu, Cho-Ching Chen | 2003-11-25 |
| 6570257 | IMD film composition for dual damascene process | Ching-Tien Ma, Hsiang-Tan Lee | 2003-05-27 |
| 6551927 | CoSix process to improve junction leakage | Kwang-Ming Lin, Yu-Ku Lin, Tong-Hua Kuan, Jin-Kuen Lan | 2003-04-22 |