Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6645825 | Planarization of shallow trench isolation (STI) | Chin Kun Lan, Tong-Hua Kuan, Ying-Lang Wang | 2003-11-11 |
| 6626741 | Method for improving thickness uniformity on a semiconductor wafer during chemical mechanical polishing | Kei-Wei Chen, Shih-Tzung Chang, Yu-Ku Lin, Ying-Lang Wang | 2003-09-30 |