Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6638867 | Method for forming a top interconnection level and bonding pads on an integrated circuit chip | Yuan-Lung Liu | 2003-10-28 |
| 6635576 | Method of fabricating borderless contact using graded-stair etch stop layers | Lin-June Wu, Kwang-Ming Lin | 2003-10-21 |