YL

Yuan-Lung Liu

TSMC: 1 patents #218 of 754Top 30%
📍 Oakland, CA: #67 of 224 inventorsTop 30%
🗺 California: #8,996 of 28,521 inventorsTop 35%
Overall (2003): #84,128 of 273,478Top 35%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6638867 Method for forming a top interconnection level and bonding pads on an integrated circuit chip Meng-Chang Liu 2003-10-28