Issued Patents 2003
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6649471 | Method of planarizing non-volatile memory device | Min-Soo Cho, Dong-Jun KIM, Eui-Youl Ryu, Dai-Goun Kim, Young-Hee Kim +3 more | 2003-11-18 |
| 6626968 | Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same | Young-rae Park, Jung-yup Kim, Bo-Un Yoon, Kwang-bok Kim, Jae-Phil Boo +3 more | 2003-09-30 |
| 6610596 | Method of forming metal interconnection using plating and semiconductor device manufactured by the method | Jong Won Lee, Bo-Un Yoon, Kun-Tack Lee | 2003-08-26 |
| 6585570 | Method and apparatus for supplying chemical-mechanical polishing slurries | Jung-yup Kim, Young-rae Park | 2003-07-01 |
| 6565736 | WET PROCESS FOR SEMICONDUCTOR DEVICE FABRICATION USING ANODE WATER CONTAINING OXIDATIVE SUBSTANCES AND CATHODE WATER CONTAINING REDUCTIVE SUBSTANCES, AND ANODE WATER AND CATHODE WATER USED IN THE WET PROCESS | Im-Soo Park, Kun-Tack Lee, Young Min Kwon, Woo-Gwan Shim, Hyung-Ho Ko | 2003-05-20 |
| 6548388 | Semiconductor device including gate electrode having damascene structure and method of fabricating the same | Hong-kyu Hwang, Young-rae Park, Jung-yup Kim, Jeong-sic Jeon, Bo-Un Yoon | 2003-04-15 |
| 6540935 | Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same | Jong Won Lee, Jae-Dong Lee, Bo Yoon | 2003-04-01 |
| 6518157 | Methods of planarizing insulating layers on regions having different etching rates | Gee-won Nam, Gi-jong Park, Hong-kyu Hwang, Jun-Shik Bae, Young-rae Park +2 more | 2003-02-11 |
| 6517412 | Method of controlling wafer polishing time using sample-skip algorithm and wafer polishing using the same | Jae-Dong Lee, Bo-Un Yoon, Kyoung-mo Yang | 2003-02-11 |
| 6514862 | Wafer polishing slurry and chemical mechanical polishing (CMP) method using the same | Jae-Dong Lee, Jong Won Lee, Bo-Un Yoon | 2003-02-04 |
| 6506682 | Non-selective slurries for chemical mechanical polishing of metal layers and method for manufacturing thereof | Jong Won Lee | 2003-01-14 |