Issued Patents 2003
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6660627 | Method for planarization of wafers with high selectivities | Shao-Chung Hu, Shih-Hsun Hsu, Chia-Lin Hsu | 2003-12-09 |
| 6638391 | Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same | Chia-Lin Hsu, Art Yu, Shih-Hsun Hsu | 2003-10-28 |
| 6583489 | Method for forming interconnect structure with low dielectric constant | Sung-Hsiung Wang, Yi-Min Huang, Gwo-Shii Yang, Chiung-Sheng Hsiung, Chih-Chien Liu | 2003-06-24 |
| 6580508 | Method for monitoring a semiconductor wafer in a chemical mechanical polishing process | Chien-Hung Chen, Juan-Yuan Wu | 2003-06-17 |
| 6559004 | Method for forming three dimensional semiconductor structure and three dimensional capacitor | Gwo-Shii Yang, Chiung-Sheng Hsiung, Tong-Yu Chen, Sung-Hsiung Wang | 2003-05-06 |
| 6544373 | Polishing pad for a chemical mechanical polishing process | Teng-Chun Tsai | 2003-04-08 |
| 6524962 | Method for forming dual-damascene interconnect structure | Teng-Chun Tsai, Yi-Min Huang | 2003-02-25 |