Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6617234 | Method of forming metal fuse and bonding pad | Yimin Huang, Chiung-Sheng Hsiung | 2003-09-09 |
| 6583489 | Method for forming interconnect structure with low dielectric constant | Yi-Min Huang, Gwo-Shii Yang, Chiung-Sheng Hsiung, Hsueh-Chung Chen, Chih-Chien Liu | 2003-06-24 |
| 6559004 | Method for forming three dimensional semiconductor structure and three dimensional capacitor | Gwo-Shii Yang, Hsueh-Chung Chen, Chiung-Sheng Hsiung, Tong-Yu Chen | 2003-05-06 |