Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6638830 | Method for fabricating a high-density capacitor | Chia-Lin Hsu, Yi-Fang Cheng | 2003-10-28 |
| 6616510 | Chemical mechanical polishing method for copper | Chia-Lin Hsu, Yung-Tsung Wei, Ming-Sheng Yang | 2003-09-09 |
| 6593185 | Method of forming embedded capacitor structure applied to logic integrated circuit | Chia-Lin Hsu, Yi-Fang Cheng, Yi-Hsiung Lin | 2003-07-15 |
| 6544373 | Polishing pad for a chemical mechanical polishing process | Hsueh-Chung Chen | 2003-04-08 |
| 6524962 | Method for forming dual-damascene interconnect structure | Hsueh-Chung Chen, Yi-Min Huang | 2003-02-25 |