Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6660627 | Method for planarization of wafers with high selectivities | Shao-Chung Hu, Hsueh-Chung Chen, Shih-Hsun Hsu | 2003-12-09 |
| 6638391 | Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same | Art Yu, Shih-Hsun Hsu, Hsueh-Chung Chen | 2003-10-28 |
| 6638830 | Method for fabricating a high-density capacitor | Teng-Chun Tsai, Yi-Fang Cheng | 2003-10-28 |
| 6616510 | Chemical mechanical polishing method for copper | Teng-Chun Tsai, Yung-Tsung Wei, Ming-Sheng Yang | 2003-09-09 |
| 6593185 | Method of forming embedded capacitor structure applied to logic integrated circuit | Teng-Chun Tsai, Yi-Fang Cheng, Yi-Hsiung Lin | 2003-07-15 |