Issued Patents 2003
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6661100 | Low impedance power distribution structure for a semiconductor chip package | Brent A. Anderson, Randolph F. Knarr, Sarah H. Knickerbocker, Kamalesh K. Srivastava | 2003-12-09 |
| 6642080 | Chip-on-chip interconnections of varied characterstics | Thomas G. Ference, Wayne J. Howell | 2003-11-04 |
| 6635970 | Power distribution design method for stacked flip-chip packages | Jerome B. Lasky, Edward J. Nowak | 2003-10-21 |
| 6627477 | Method of assembling a plurality of semiconductor devices having different thickness | Mark C. Hakey, Steven J. Holmes, David V. Horak, Harold G. Linde | 2003-09-30 |
| 6566759 | Self-aligned contact areas for sidewall image transfer formed conductors | Edward W. Conrad, Chung H. Lam, Dale W. Martin | 2003-05-20 |
| 6507115 | Multi-chip integrated circuit module | Harm Peter Hofstee, Robert K. Montoye | 2003-01-14 |