Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6661100 | Low impedance power distribution structure for a semiconductor chip package | Brent A. Anderson, Sarah H. Knickerbocker, Edmund J. Sprogis, Kamalesh K. Srivastava | 2003-12-09 |
| 6622907 | Sacrificial seed layer process for forming C4 solder bumps | Lisa A. Fanti, Erik J. Roggeman, Kamalesh K. Srivastava | 2003-09-23 |