LF

Lisa A. Fanti

IBM: 1 patents #1,943 of 5,539Top 40%
📍 Hopewell Junction, NY: #46 of 96 inventorsTop 50%
🗺 New York: #3,048 of 9,423 inventorsTop 35%
Overall (2003): #171,680 of 273,478Top 65%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6622907 Sacrificial seed layer process for forming C4 solder bumps Randolph F. Knarr, Erik J. Roggeman, Kamalesh K. Srivastava 2003-09-23