Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6661100 | Low impedance power distribution structure for a semiconductor chip package | Brent A. Anderson, Randolph F. Knarr, Sarah H. Knickerbocker, Edmund J. Sprogis | 2003-12-09 |
| 6622907 | Sacrificial seed layer process for forming C4 solder bumps | Lisa A. Fanti, Randolph F. Knarr, Erik J. Roggeman | 2003-09-23 |
| 6531069 | Reactive Ion Etching chamber design for flip chip interconnections | Peter C. Wade, William Brearley, Jonathan H. Griffith | 2003-03-11 |