ER

Erik J. Roggeman

IBM: 1 patents #1,943 of 5,539Top 40%
📍 Fishkill, NY: #17 of 55 inventorsTop 35%
🗺 New York: #3,048 of 9,423 inventorsTop 35%
Overall (2003): #229,356 of 273,478Top 85%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6622907 Sacrificial seed layer process for forming C4 solder bumps Lisa A. Fanti, Randolph F. Knarr, Kamalesh K. Srivastava 2003-09-23