Issued Patents 2003
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656765 | Fabricating very thin chip size semiconductor packages | — | 2003-12-02 |
| 6650019 | Method of making a semiconductor package including stacked semiconductor dies | Thomas P. Glenn, Lee Smith, David Zoba, Kambhampati Ramakrishna | 2003-11-18 |
| 6624005 | Semiconductor memory cards and method of making same | Kenneth Kaskoun | 2003-09-23 |
| 6589801 | Wafer-scale production of chip-scale semiconductor packages using wafer mapping techniques | Ju Hoon Yoon, Dae Byung Kang, In Bae Park, Markus K. Liebhard | 2003-07-08 |
| 6577013 | Chip size semiconductor packages with stacked dies | Thomas P. Glenn, Steven Webster | 2003-06-10 |
| 6531784 | Semiconductor package with spacer strips | Il Kwon Shim, Kambhampati Ramakrishna | 2003-03-11 |
| 6517656 | Method of making an integrated circuit package using a batch step for curing a die attachment film and a tool system for performing the method | — | 2003-02-11 |
| 6515356 | Semiconductor package and method for fabricating the same | Won Sun Shin, Seon Goo Lee, Do Sung Chun, Tae Hoan Jang | 2003-02-04 |
| 6512288 | Circuit board semiconductor package | WonSun Shin, SeonGoo Lee, TaeHoan Jang, DoSung Chun | 2003-01-28 |