Issued Patents 2003
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6670698 | Integrated circuit package mounting | Steven Webster, Roy Dale Hollaway | 2003-12-30 |
| 6667544 | Stackable package having clips for fastening package and tool for opening clips | — | 2003-12-23 |
| 6661080 | Structure for backside saw cavity protection | Steven Webster, Roy Dale Hollaway | 2003-12-09 |
| 6657298 | Integrated circuit chip package having an internal lead | — | 2003-12-02 |
| 6650019 | Method of making a semiconductor package including stacked semiconductor dies | Lee Smith, David Zoba, Kambhampati Ramakrishna, Vincent DiCaprio | 2003-11-18 |
| 6638789 | Micromachine stacked wirebonded package fabrication method | Steven Webster, Roy Dale Hollaway | 2003-10-28 |
| 6630728 | Plastic integrated circuit package and leadframe for making the package | — | 2003-10-07 |
| 6629633 | Chip size image sensor bumped package fabrication method | Steven Webster, Markus K. Liebhard | 2003-10-07 |
| 6627987 | Ceramic semiconductor package and method for fabricating the package | Roy Dale Hollaway, Steven Webster | 2003-09-30 |
| 6627864 | Thin image sensor package | Steven Webster, Roy Dale Hollaway | 2003-09-30 |
| 6624921 | Micromirror device package fabrication method | Steven Webster, Roy Dale Hollaway | 2003-09-23 |
| 6620646 | Chip size image sensor wirebond package fabrication method | Steven Webster, Markus K. Liebhard | 2003-09-16 |
| 6610167 | Method for fabricating a special-purpose die using a polymerizable tape | Steven Webster, Roy Dale Hollaway | 2003-08-26 |
| 6601293 | Method of making an electromagnetic interference shield device | — | 2003-08-05 |
| 6586824 | Reduced thickness packaged electronic device | Steven Webster, Roy Dale Hollaway | 2003-07-01 |
| 6586826 | Integrated circuit package having posts for connection to other packages and substrates | Steven M. Anderson, Steven Webster | 2003-07-01 |
| 6586677 | Plastic integrated circuit device package having exposed lead surface | — | 2003-07-01 |
| 6580167 | Heat spreader with spring IC package | Steven Webster, Roy Dale Hollaway | 2003-06-17 |
| 6580153 | Structure for protecting a micromachine with a cavity in a UV tape | Roy Dale Hollaway, Steven Webster | 2003-06-17 |
| 6577013 | Chip size semiconductor packages with stacked dies | Steven Webster, Vincent DiCaprio | 2003-06-10 |
| 6571466 | Flip chip image sensor package fabrication method | Steven Webster, Roy Dale Hollaway | 2003-06-03 |
| 6572944 | Structure for fabricating a special-purpose die using a polymerizable tape | Steven Webster, Roy Dale Hollaway | 2003-06-03 |
| 6566164 | Exposed copper strap in a semiconductor package | Blake A. Gillett | 2003-05-20 |
| 6564454 | Method of making and stacking a semiconductor package | Steven Webster, Roy D. Holloway | 2003-05-20 |
| 6562655 | Heat spreader with spring IC package fabrication method | Steven Webster, Roy Dale Hollaway | 2003-05-13 |