Issued Patents 2003
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6670698 | Integrated circuit package mounting | Thomas P. Glenn, Steven Webster | 2003-12-30 |
| 6661080 | Structure for backside saw cavity protection | Thomas P. Glenn, Steven Webster | 2003-12-09 |
| 6638789 | Micromachine stacked wirebonded package fabrication method | Thomas P. Glenn, Steven Webster | 2003-10-28 |
| 6627864 | Thin image sensor package | Thomas P. Glenn, Steven Webster | 2003-09-30 |
| 6627987 | Ceramic semiconductor package and method for fabricating the package | Thomas P. Glenn, Steven Webster | 2003-09-30 |
| 6624921 | Micromirror device package fabrication method | Thomas P. Glenn, Steven Webster | 2003-09-23 |
| 6610167 | Method for fabricating a special-purpose die using a polymerizable tape | Thomas P. Glenn, Steven Webster | 2003-08-26 |
| 6586824 | Reduced thickness packaged electronic device | Thomas P. Glenn, Steven Webster | 2003-07-01 |
| 6580153 | Structure for protecting a micromachine with a cavity in a UV tape | Thomas P. Glenn, Steven Webster | 2003-06-17 |
| 6580167 | Heat spreader with spring IC package | Thomas P. Glenn, Steven Webster | 2003-06-17 |
| 6572944 | Structure for fabricating a special-purpose die using a polymerizable tape | Thomas P. Glenn, Steven Webster | 2003-06-03 |
| 6571466 | Flip chip image sensor package fabrication method | Thomas P. Glenn, Steven Webster | 2003-06-03 |
| 6562655 | Heat spreader with spring IC package fabrication method | Thomas P. Glenn, Steven Webster | 2003-05-13 |
| 6548759 | Pre-drilled image sensor package | Thomas P. Glenn, Steven Webster | 2003-04-15 |
| 6545345 | Mounting for a package containing a chip | Thomas P. Glenn, Steven Webster | 2003-04-08 |
| 6530515 | Micromachine stacked flip chip package fabrication method | Thomas P. Glenn, Steven Webster | 2003-03-11 |
| 6532157 | Angulated semiconductor packages | Thomas P. Glenn, Steven Webster | 2003-03-11 |
| 6528869 | Semiconductor package with molded substrate and recessed input/output terminals | Thomas P. Glenn | 2003-03-04 |
| 6528875 | Vacuum sealed package for semiconductor chip | Thomas P. Glenn, Steven Webster | 2003-03-04 |
| 6522015 | Micromachine stacked wirebonded package | Thomas P. Glenn, Steven Webster | 2003-02-18 |
| 6515269 | Integrally connected image sensor packages having a window support in contact with a window and the active area | Steven Webster, Tony Arellano | 2003-02-04 |
| 6512219 | Fabrication method for integrally connected image sensor packages having a window support in contact with the window and active area | Steven Webster, Tony Arellano | 2003-01-28 |