Issued Patents 2003
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6670698 | Integrated circuit package mounting | Thomas P. Glenn, Roy Dale Hollaway | 2003-12-30 |
| 6661080 | Structure for backside saw cavity protection | Thomas P. Glenn, Roy Dale Hollaway | 2003-12-09 |
| 6638789 | Micromachine stacked wirebonded package fabrication method | Thomas P. Glenn, Roy Dale Hollaway | 2003-10-28 |
| 6629633 | Chip size image sensor bumped package fabrication method | Thomas P. Glenn, Markus K. Liebhard | 2003-10-07 |
| 6627864 | Thin image sensor package | Thomas P. Glenn, Roy Dale Hollaway | 2003-09-30 |
| 6627987 | Ceramic semiconductor package and method for fabricating the package | Thomas P. Glenn, Roy Dale Hollaway | 2003-09-30 |
| 6624921 | Micromirror device package fabrication method | Thomas P. Glenn, Roy Dale Hollaway | 2003-09-23 |
| 6620646 | Chip size image sensor wirebond package fabrication method | Thomas P. Glenn, Markus K. Liebhard | 2003-09-16 |
| 6610167 | Method for fabricating a special-purpose die using a polymerizable tape | Thomas P. Glenn, Roy Dale Hollaway | 2003-08-26 |
| 6586826 | Integrated circuit package having posts for connection to other packages and substrates | Thomas P. Glenn, Steven M. Anderson | 2003-07-01 |
| 6586824 | Reduced thickness packaged electronic device | Thomas P. Glenn, Roy Dale Hollaway | 2003-07-01 |
| 6580153 | Structure for protecting a micromachine with a cavity in a UV tape | Thomas P. Glenn, Roy Dale Hollaway | 2003-06-17 |
| 6580167 | Heat spreader with spring IC package | Thomas P. Glenn, Roy Dale Hollaway | 2003-06-17 |
| 6577013 | Chip size semiconductor packages with stacked dies | Thomas P. Glenn, Vincent DiCaprio | 2003-06-10 |
| 6572944 | Structure for fabricating a special-purpose die using a polymerizable tape | Thomas P. Glenn, Roy Dale Hollaway | 2003-06-03 |
| 6571466 | Flip chip image sensor package fabrication method | Thomas P. Glenn, Roy Dale Hollaway | 2003-06-03 |
| 6564454 | Method of making and stacking a semiconductor package | Thomas P. Glenn, Roy D. Holloway | 2003-05-20 |
| 6562655 | Heat spreader with spring IC package fabrication method | Thomas P. Glenn, Roy Dale Hollaway | 2003-05-13 |
| 6548759 | Pre-drilled image sensor package | Thomas P. Glenn, Roy Dale Hollaway | 2003-04-15 |
| 6545345 | Mounting for a package containing a chip | Thomas P. Glenn, Roy Dale Hollaway | 2003-04-08 |
| 6530515 | Micromachine stacked flip chip package fabrication method | Thomas P. Glenn, Roy Dale Hollaway | 2003-03-11 |
| 6532157 | Angulated semiconductor packages | Thomas P. Glenn, Roy Dale Hollaway | 2003-03-11 |
| 6526653 | Method of assembling a snap lid image sensor package | Thomas P. Glenn | 2003-03-04 |
| 6528875 | Vacuum sealed package for semiconductor chip | Thomas P. Glenn, Roy Dale Hollaway | 2003-03-04 |
| 6528857 | Chip size image sensor bumped package | Thomas P. Glenn, Markus K. Liebhard | 2003-03-04 |