Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6650019 | Method of making a semiconductor package including stacked semiconductor dies | Thomas P. Glenn, Lee Smith, Kambhampati Ramakrishna, Vincent DiCaprio | 2003-11-18 |
| 6603072 | Making leadframe semiconductor packages with stacked dies and interconnecting interposer | Donald C. Foster | 2003-08-05 |