Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6650019 | Method of making a semiconductor package including stacked semiconductor dies | Thomas P. Glenn, Lee Smith, David Zoba, Vincent DiCaprio | 2003-11-18 |
| 6627990 | Thermally enhanced stacked die package | Il Kwon Shim, Seng Gaun Chow | 2003-09-30 |
| 6531784 | Semiconductor package with spacer strips | Il Kwon Shim, Vincent DiCaprio | 2003-03-11 |