Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6627990 | Thermally enhanced stacked die package | Kambhampati Ramakrishna, Seng Gaun Chow | 2003-09-30 |
| 6599779 | PBGA substrate for anchoring heat sink | Seng Guan Chow, Gerry Balanon | 2003-07-29 |
| 6534859 | Semiconductor package having heat sink attached to pre-molded cavities and method for creating the package | Seng Guan Chow, Gerry Balanon | 2003-03-18 |
| 6531784 | Semiconductor package with spacer strips | Kambhampati Ramakrishna, Vincent DiCaprio | 2003-03-11 |