Issued Patents 2003
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6563204 | Microcircuit die-sawing protector | — | 2003-05-13 |
| 6548759 | Pre-drilled image sensor package | Steven Webster, Roy Dale Hollaway | 2003-04-15 |
| 6545345 | Mounting for a package containing a chip | Steven Webster, Roy Dale Hollaway | 2003-04-08 |
| 6534876 | Flip-chip micromachine package | — | 2003-03-18 |
| 6532157 | Angulated semiconductor packages | Roy Dale Hollaway, Steven Webster | 2003-03-11 |
| 6530515 | Micromachine stacked flip chip package fabrication method | Steven Webster, Roy Dale Hollaway | 2003-03-11 |
| 6528857 | Chip size image sensor bumped package | Steven Webster, Markus K. Liebhard | 2003-03-04 |
| 6528875 | Vacuum sealed package for semiconductor chip | Roy Dale Hollaway, Steven Webster | 2003-03-04 |
| 6528869 | Semiconductor package with molded substrate and recessed input/output terminals | Roy Dale Hollaway | 2003-03-04 |
| 6526653 | Method of assembling a snap lid image sensor package | Steven Webster | 2003-03-04 |
| 6521987 | Plastic integrated circuit device package and method for making the package | Scott Joseph Jewler, David Roman, Jae Hak Yee, Doo Hwan Moon | 2003-02-18 |
| 6522015 | Micromachine stacked wirebonded package | Steven Webster, Roy Dale Hollaway | 2003-02-18 |
| 6518659 | Stackable package having a cavity and a lid for an electronic device | — | 2003-02-11 |
| 6509560 | Chip size image sensor in wirebond package with step-up ring for electrical contact | Steven Webster, Markus K. Liebhard | 2003-01-21 |
| 6503780 | Wafer scale image sensor package fabrication method | Steven Webster, Tony Arellano | 2003-01-07 |