Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6589801 | Wafer-scale production of chip-scale semiconductor packages using wafer mapping techniques | Dae Byung Kang, In Bae Park, Vincent DiCaprio, Markus K. Liebhard | 2003-07-08 |