Issued Patents 2002
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6493932 | Lidless socket and method of making same | — | 2002-12-17 |
| 6496255 | Measurement of crystal face orientation | Kazumi Sugai, Yukio Morishige | 2002-12-17 |
| 6495462 | Components with releasable leads | Hamid Eslampour, Konstantine Karavakis | 2002-12-17 |
| 6492251 | Microelectronic joining processes with bonding material application | Klaus Wolter | 2002-12-10 |
| 6492201 | Forming microelectronic connection components by electrophoretic deposition | — | 2002-12-10 |
| 6489674 | Method for creating a die shrink insensitive semiconductor package and component therefor | John W. Smith | 2002-12-03 |
| 6449159 | Semiconductor module with imbedded heat spreader | — | 2002-09-10 |
| 6428328 | Method of making a connection to a microelectronic element | Anthony B. Faraci | 2002-08-06 |
| 6429112 | Multi-layer substrates and fabrication processes | John W. Smith | 2002-08-06 |
| 6423907 | Components with releasable leads | Konstantine Karavakis | 2002-07-23 |
| 6384475 | Lead formation using grids | Masud Beroz, Christopher M. Pickett | 2002-05-07 |
| 6378758 | Conductive leads with non-wettable surfaces | — | 2002-04-30 |
| 6376904 | Redistributed bond pads in stacked integrated circuit die package | Donald V. Perino, Sayeh Khalili | 2002-04-23 |
| 6374487 | Method of making a connection to a microelectronic element | Anthony B. Faraci | 2002-04-23 |
| 6361959 | Microelectronic unit forming methods and materials | Masud Beroz, Joseph Fjelstad, Christopher M. Pickett, John W. Smith | 2002-03-26 |
| 6357112 | Method of making connection component | Thomas H. DiStefano, Joseph Fjelstad, Owais Jamil, Konstantine Karavakis, David Light +1 more | 2002-03-19 |
| 6334942 | Selective removal of dielectric materials and plating process using same | Irina Poukhova, Masud Beroz | 2002-01-01 |