Issued Patents 2002
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6489674 | Method for creating a die shrink insensitive semiconductor package and component therefor | Belgacem Haba | 2002-12-03 |
| 6486547 | Microelectronic assembly incorporating lead regions defined by gaps in a polymeric sheet | Joseph Fjelstad | 2002-11-26 |
| 6468836 | Laterally situated stress/strain relieving lead for a semiconductor chip package | Thomas H. DiStefano, Joseph Fjelstad | 2002-10-22 |
| 6441488 | Fan-out translator for a semiconductor package | — | 2002-08-27 |
| 6437240 | Microelectronic connections with liquid conductive elements | — | 2002-08-20 |
| 6429112 | Multi-layer substrates and fabrication processes | Belgacem Haba | 2002-08-06 |
| 6420661 | Connector element for connecting microelectronic elements | Thomas H. Di Stefano | 2002-07-16 |
| 6373141 | Bondable compliant pads for packaging of a semiconductor chip and method therefor | Thomas H. DiStefano, Zlata Kovac | 2002-04-16 |
| 6370032 | Compliant microelectronic mounting device | Thomas H. DiStefano, Zlata Kovac, Konstantine Karavakis | 2002-04-09 |
| 6365975 | Chip with internal signal routing in external element | Thomas H. DiStefano | 2002-04-02 |
| 6365436 | Connecting multiple microelectronic elements with lead deformation | Tony Faraci, Thomas H. DiStefano | 2002-04-02 |
| 6361959 | Microelectronic unit forming methods and materials | Masud Beroz, Joseph Fjelstad, Belgacem Haba, Christopher M. Pickett | 2002-03-26 |
| 6357112 | Method of making connection component | Thomas H. DiStefano, Joseph Fjelstad, Belgacem Haba, Owais Jamil, Konstantine Karavakis +1 more | 2002-03-19 |
| 6359335 | Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures | Thomas H. DiStefano, Craig Mitchell | 2002-03-19 |
| 6358780 | Semiconductor package assemblies with moisture vents and methods of making same | Christopher M. Pickett | 2002-03-19 |
| 6338982 | Enhancements in framed sheet processing | Masud Beroz, Thomas H. DiStefano, Matthew T. Hendrickson, David Light | 2002-01-15 |