Issued Patents 2002
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6499216 | Methods and structures for electronic probing arrays | — | 2002-12-31 |
| 6486547 | Microelectronic assembly incorporating lead regions defined by gaps in a polymeric sheet | John W. Smith | 2002-11-26 |
| 6486003 | Expandable interposer for a microelectronic package and method therefor | — | 2002-11-26 |
| 6468836 | Laterally situated stress/strain relieving lead for a semiconductor chip package | Thomas H. DiStefano, John W. Smith | 2002-10-22 |
| 6465747 | Microelectronic assemblies having solder-wettable pads and conductive elements | Thomas H. DiStefano | 2002-10-15 |
| 6465878 | Compliant microelectronic assemblies | Konstantine Karavakis | 2002-10-15 |
| 6458681 | Method for providing void free layer for semiconductor assemblies | Thomas H. DiStefano | 2002-10-01 |
| 6417029 | Compliant package with conductive elastomeric posts | — | 2002-07-09 |
| 6373128 | Semiconductor assemblies with reinforced peripheral regions | Konstantine Karavakis | 2002-04-16 |
| 6361959 | Microelectronic unit forming methods and materials | Masud Beroz, Belgacem Haba, Christopher M. Pickett, John W. Smith | 2002-03-26 |
| 6357112 | Method of making connection component | Thomas H. DiStefano, Belgacem Haba, Owais Jamil, Konstantine Karavakis, David Light +1 more | 2002-03-19 |