Issued Patents 2002
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6468836 | Laterally situated stress/strain relieving lead for a semiconductor chip package | Joseph Fjelstad, John W. Smith | 2002-10-22 |
| 6465893 | Stacked chip assembly | Igor Y. Khandros | 2002-10-15 |
| 6465747 | Microelectronic assemblies having solder-wettable pads and conductive elements | Joseph Fjelstad | 2002-10-15 |
| 6460245 | Method of fabricating semiconductor chip assemblies | — | 2002-10-08 |
| 6458681 | Method for providing void free layer for semiconductor assemblies | Joseph Fjelstad | 2002-10-01 |
| 6458628 | Methods of encapsulating a semiconductor chip using a settable encapsulant | Craig Mitchell | 2002-10-01 |
| 6433419 | Face-up semiconductor chip assemblies | Igor Y. Khandros | 2002-08-13 |
| 6392306 | Semiconductor chip assembly with anisotropic conductive adhesive connections | Igor Y. Khandros | 2002-05-21 |
| 6388340 | Compliant semiconductor chip package with fan-out leads and method of making same | — | 2002-05-14 |
| 6372527 | Methods of making semiconductor chip assemblies | Igor Y. Khandros | 2002-04-16 |
| 6373141 | Bondable compliant pads for packaging of a semiconductor chip and method therefor | Zlata Kovac, John W. Smith | 2002-04-16 |
| 6370032 | Compliant microelectronic mounting device | John W. Smith, Zlata Kovac, Konstantine Karavakis | 2002-04-09 |
| 6365975 | Chip with internal signal routing in external element | John W. Smith | 2002-04-02 |
| 6365436 | Connecting multiple microelectronic elements with lead deformation | Tony Faraci, John W. Smith | 2002-04-02 |
| 6362520 | Microelectronic mounting with multiple lead deformation using restraining straps | — | 2002-03-26 |
| 6357112 | Method of making connection component | Joseph Fjelstad, Belgacem Haba, Owais Jamil, Konstantine Karavakis, David Light +1 more | 2002-03-19 |
| 6359335 | Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures | John W. Smith, Craig Mitchell | 2002-03-19 |
| 6359236 | Mounting component with leads having polymeric strips | Gary W. Grube, Igor Y. Khandros, Gaetan Mathiew | 2002-03-19 |
| 6354485 | Thermally enhanced packaged semiconductor assemblies | — | 2002-03-12 |
| 6338982 | Enhancements in framed sheet processing | Masud Beroz, Matthew T. Hendrickson, David Light, John W. Smith | 2002-01-15 |
| 6335222 | Microelectronic packages with solder interconnections | — | 2002-01-01 |